2025 DW Speaker Contact Information
Aborn James, E Ink Corporation, Billerica MA, US, Email: jaborn@eink.com
Agahian Farnaz, Samsung Display America Lab, San Jose CA, US, Email: f.agahian@samsung.com
Ahn Kyusu, Samsung Display Co., Ltd., Yongin, South Korea, Email: kyusu.ahn@snu.ac.kr
Ai Ziyang, BOE Technology Group Co., Ltd., Beijing, China, Email: aiziyang@boe.com.cn
Altaqui Ali, Reality Labs, Meta Platforms Inc., Redmond WA, US, Email: alialtaqui@meta.com
Amemiya Takahisa, FICT Ltd., Nagano NY, Japan, Email: amemiya.takahis@fict-g.com
Amgalan Tuvshinjargal, Chungbuk National University, Cheongju, South Korea, Email: tuwshinjargal@chungbuk.ac.kr
An Qichang, BOE Sensor Technology Company, Ltd., Beijing BC, China, Email: anqichang@boe.com.cn
Annis Charles, Omdia, Kyoto, Japan, Email: charles.annis@Omdia.com
Asagi Hiroaki, Sharp Corp., Nara, Japan, Email: asagi.hiroaki@sharp.co.jp
Ba Jing, TCL China Star Optoelectronics Technology Co., Ltd., Shenzhen, China, Email: bajing@tcl.com
Bae Eun Jeong, Korea University, Seoul, South Korea, Email: baeejng@korea.ac.kr
Bae Kwang Soo, Samsung Display Co., Ltd., Yongin, South Korea, Email: ks98.bae@samsung.com
Baek Cris Seungin, Samsung Display Co., Ltd., Yongin, South Korea, Email: s.i.baek@samsung.com
Bai Peng, BOE Technology Group Co., Ltd., Beijing, China, Email: baipeng@boe.com.cn
Bain Stephen, FlexEnable Technology, Ltd., Cambridge, UK, Email: stephen.bain@flexenable.com
Balakrishnan Kaushik, Samsung Display America Lab, San Jose CA, US, Email: k.bala@samsung.com
Ban Hyunmin, University of Hong Kong, Hong Kong, Hong Kong, Email: hmban@connect.hku.hk
Banerjee Joy, Corning Inc., Painted Post NY, US, Email: BanerjeeJ@Corning.com
Beams Ryan, US FDA, Silver Spring MD, US, Email: ryan.beams@fda.hhs.gov
Becker Michael, Display-Messtechnik & Systeme, Rottenburg am Neckar, Germany, Email: sid@display-messtechnik.de
Bencheikh Fatima, KOALA Tech, Inc., Fukuoka, Japan, Email: fatima.bencheikh@koalatech.co.jp
Berends Anne, SunLED Life Science BV, Amsterdam, Netherlands, Email: a.berends@sunled.health
Bestelink Eva, University of Surrey, Guildford, UK, Email: e.bestelink@surrey.ac.uk
Bhadra Debjyoti, Hong Kong University of Science and Technology, Hong Kong, Hong Kong, Email: dbhadra@connect.ust.hk
Biswas Pooshpanjan Roy, DXOMARK, Boulogne Billancourt, France, Email: pbiswas@dxomark.com
Björk Mikael, Hexagem AB, Lund, Sweden, Email: mikael.bjork@hexagem.se
Blülle Balthasar, Fluxim AG, Winterthur, Switzerland, Email: balthasar.bluelle@fluxim.com
Blankenbach Karlheinz, Pforzheim University, Display Lab, Pforzheim, Germany, Email: karlheinz.blankenbach@hs-pforzheim.de
Bower Chris, X Display Company, Research Triangle Park NC, US, Email: chris@xdisplay.com
Brunnstrom Kjell, RISE Research Institutes of Sweden AB, Kista, Sweden, Email: kjell.brunnstrom@ri.se
Byun Chun-Won, Electronics and Telecommunications Research Institute, Daejeon, South Korea, Email: cwbyun@etri.re.kr
Cai Minghan, Beijing Visionox Technology Co., Ltd., Beijing, China, Email: caimh@visionox.com
Cao Xuan, Chengdu Vistar Optoelectronics, Ltd., Chengdu, China, Email: markcao@vistardisplay.com
Cha SB, Visban Corporation, Tokyo NY, Japan, Email: sbcha@visban.com
Chaji Reza, VueReal, Waterloo ON, Canada, Email: chaji@vuereal.com
Chamberlin Danielle, NanoPattern Technologies, Chicago IL, US, Email: dchamberlin@nanopatterntechnologies.com
Chan Park Kee, Konkuk University, Seoul, South Korea, Email: keechan@konkuk.ac.kr
Chang ChingYun, AUO Corp., Hsinchu, Taiwan ROC, Email: chingyun.chang@auo.com
Chang Shou-Zen, Powerchip Semiconductor Manufacturing Corp., Hsinchu, Taiwan ROC, Email: szchang@powerchip.com
Chang Yao-Chung, Novatek Microelectronics Corp., Hsinchu, Taiwan ROC, Email: Johnny_YC_Chang@novatek.com.tw
Chen Chien Yu, National Taiwan University Of Science And Technology, Taipei, Taiwan ROC, Email: chencyue@mail.ntust.edu.tw
Chen Fa-Hsyang, Kunshan Govisionox Optoelectronics Co., Ltd., Jiangsu, China, Email: tomchen@visionox.com
Chen Fa-Hsyang, Kunshan Govisionox Optoelectronics Co., Ltd., Jiangsu, China, Email: tomchen@visionox.com
Chen Hsin-Ying, AUO Corp., Hsinchu, Taiwan ROC, Email: HsinYing.Chen@auo.com
Chen Lin, Hefei Visionox Technology Co., Ltd., Hefei, China, Email: chenlin@visionox.com
Chen Long, Tianma Microelectronics Co., Ltd., Shanghai, China, Email: long_chen16@tianma.cn
Chen Po-Jui, National Taiwan University, Taipei, Taiwan Roc, Email: f08943072@ntu.edu.tw
Chen Shuming, Southern University of Science and Technology, Shenzhen, China, Email: chensm@sustech.edu.cn
Chen Ya-Ling, AUO Corporation, Hsinchu, Taiwan Roc, Email: Mavis.Chen@auo.com
Chen Ying, AU Optical Corporation, Hsinchu, Taiwan Roc, Email: Yingchieh.Chen@auo.com
Chen Yu-Da, BenQ Materials Corp., Taoyuan, Taiwan ROC, Email: Xavier.Chen@BenQMaterials.com
Chen Zhao-Yi, Hong Kong University of Science and Technology, Hong Kong, Hong Kong, Email: zchenhq@connect.ust.hk
Cheng Ming, Hong Kong University of Science and Technology, Hong Kong, Hong Kong, Email: mchengad@connect.ust.hk
Cheng Peng, Hefei Visionox Technology Co., Ltd., Hefei, China, Email: daviecheng@visionox.com
Cheng Shuo-Hsien, Kyulux, Inc., Fukuoka City, Japan, Email: shcheng@kyulux.com
Cheng Yue-Chu, Hong Kong University of Science and Technology, Hong Kong, Hong Kong, Email: ychengbv@connect.ust.hk
Cheng Yue-Chu, Hong Kong University of Science and Technology, Tainan, Hong Kong, Email: ychengbv@connect.ust.hk
Chiang Ray-Kuang, Taiwan Nanocrystals Corp. Ltd., Tainan City, Taiwan ROC, Email: rkc.chem@msa.hinet.net
Chiu Min-Hsuan, AUO Corp., Hsinchu, Taiwan ROC, Email: JiaHong.Ye@auo.com
Chiu Tien-Lung, Yuan Ze University, Taoyuan, Taiwan Roc, Email: tlchiu@saturn.yzu.edu.tw
Cho An-thung, Chongqing HKC Optoelectronics Technology Co., Ltd., Chongqing, China, Email: david.cho@szhk.com.cn
Cho Hyunsu, Electronics and Telecommunications Research Institute (ETRI), Daejeon, South Korea, Email: hyunsucho@etri.re.kr
Cho Jaechan, LX Semicon, Inc., Seoul, South Korea, Email: jccho@lxsemicon.com
Choi Byong-Deok, Hanyang University, Seoul, South Korea, Email: bdchoi@hanyang.ac.kr
Choi Geun Su, Korea University, Seoul, South Korea, Email: crs4964@korea.ac.kr
Choi GyuRi, Jeonbuk National University, Jeonju, South Korea, Email: choigl2171@gmail.com
Choi Hee-Jin, Sejong University, Seoul, South Korea, Email: hjchoi@sejong.ac.kr
Choi Junhyuk, Samsung Display Co., Ltd., Asan, South Korea, Email: junhk.choi@samsung.com
Choi Kyung Cheol, Korea Advanced Institute of Science and Technology, Daejeon, South Korea, Email: kyungcc@kaist.ac.kr
Choi Kyungmin, Soongsil University, Seoul, South Korea, Email: 111ckm@soongsil.ac.kr
Choi Moon Kee, Ulsan National Institute of Science and Technology, Ulsan, South Korea, Email: mkchoi@unist.ac.kr
Choi Myungwoon, YAS Co., Ltd., Paju, South Korea, Email: oeld21@yasoled.com
Choi Nakcho, Samsung Display Co., Ltd., Yongin, South Korea, Email: nakcho.choi@gmail.com
Choi Sangmoo, Google LLC, Mountain View CA, US, Email: smchoi@google.com
Choi Seung-Chan, LG Display Co., Ltd., Paju, South Korea, Email: aimolla@lgdisplay.com
Choi Wing-Kit, National Taiwan University, Taipei, Taiwan ROC, Email: wkchoi@ntu.edu.tw
Choo Byoungkwon, Samsung Display Co., Ltd., Yongin, South Korea, Email: bk.choo@samsung.com
Chung GiYoong, Sungkyunkwan University, Suwon, South Korea, Email: qu3xing29@gmail.com
Chung Hanwook, Forvia IRYStec, Inc., Montreal PQ, Canada, Email: hanwook.chung@forvia.com
Chung Horyun, Samsung Display Co., Ltd., Yongin, South Korea, Email: hr95.chung@samsung.com
Chung In Young, Samsung Display Co., Ltd., Yongin, South Korea, Email: 02ckysih@gmail.com
Chung Yi-Ting, Novatek Microelectronics Corp., Hsinchu, Taiwan ROC, Email: Nina_Chung@novatek.com.tw
Clavero Cesar, Intermolecular Inc., A Subsidiary of Merck KGaA, San Jose CA, US, Email: cesar.clavero@emdgroup.com
Coe-Sullivan Seth, NS Nanotech, Rolling Hills Estates CA, US, Email: seth@nsnanotech.com
Cui Rongzhen, Yungu(Gu’an) Technology Co., Ltd., Hebei, China, Email: cuirz@visionox.com
Dai Tao, BOE Optoelectronics Group Co., Ltd., Wuhan, China, Email: dait@boe.com.cn
de Cunsel Sebastian, Sony Semiconductor Solutions Corp., Atsugi, Japan, Email: sebastien.decunsel@sony.com
De Roose Florian, imec, Leuven, Belgium, Email: florian.deroose@imec.be
Deng Hanpeng, Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd., Wuhan, China, Email: denghanpeng1@tcl.com
Dettling Marco, University of Stuttgart, Stuttgart, Germany, Email: mdettling@igm.uni-stuttgart.de
Ding Shumeng, Goertek Co., Ltd., Xi'an, China, Email: sylvia.ding@goertek.com
Ding Yuqiang, University of Central Florida, Orlando FL, US, Email: yuqiang.ding@ucf.edu
Dong Jian-Wen, Sun Yat-sen university, Guangzhou, China, Email: dongjwen@mail.sysu.edu.cn
Dudala Mounika, UCLA, Los Angeles CA, US, Email: dudala.mounika02@gmail.com
Durnan Oliver, Columbia University, New York NY, US, Email: oad2114@columbia.edu
Fan Dejiu, Applied Materials Inc., Santa Clara CA, US, Email: Dejiu_Fan@amat.com
Fan Liujing, Tianma Display Technology Co., Ltd., Xiamen, China, Email: liujing_fan@tianma.cn
Fan Xiangbing, BOE Technology Group Co., Ltd., Beijing, China, Email: fanxiangbing@boe.com.cn
Fan-Chiang Kuan-Hsu, Himax Display Inc., Tainan City, Taiwan Roc, Email: simon_fc@himaxdisplay.com
Feng Boshi, BOE Display Technology Co., Ltd., Beijing, China, Email: fengboshi@boe.com.cn
Feng Peng, BOE Optoelectronics Group Co., Ltd., Chengdu, China, Email: Fengpeng@boe.com.cn
Feng Yi, Peking University, Shenzhen, China, Email: 365031139@qq.com
FU Changjia, BOE Technology Group Co., Ltd., Beijing, China, Email: fuchangjia@boe.com.cn
Fulmer Aaron, North Carolina State University, Raleigh NC, US, Email: apfulmer@ncsu.edu
Furuta Mamoru, Kochi University of Technology, Kochi, Japan, Email: furuta.mamoru@kochi-tech.ac.jp
Furuta Mamoru, Kochi University of Technology, Kochi, Japan, Email: furuta.mamoru@kochi-tech.ac.jp
Fuxing Jiao, Visionox Technology, Inc., Suzhou, China, Email: jiaofx@visionox.com
Gao Yongxiao, BOE Optoelectronics Group Co., Ltd., Chengdu, China, Email: gaoyongxiao@boe.com.cn
Garner Sean, Corning, Inc., Corning NY, US, Email: GarnerSM@Corning.com
Gélinas Guillaume, Vital Materials, Cupertino CA, US, Email: guillaume.gelinas@vitalchemusa.com
Geng Weibiao, Beijing BOE Display Technology Group Co., Ltd., Beijing, China, Email: gengweibiao@boe.com.cn
Geng Yue, BOE Sensing Technology Co., Ltd., Beijing, China, Email: gengyue@boe.com.cn
Ghosh Tamoghna, Intel Corporation, Bangalore, India, Email: tamoghna.ghosh@intel.com
Goetz Achim, Merck KGaA, Darmstadt, Germany, Email: achim.goetz@merckgroup.com
Gong Xiaohui, Donghua University, Shanghai, China, Email: xhgong@dhu.edu.cn
Goumans Theodorus, Software for Chemistry & Materials, Amsterdam, Netherlands, Email: goumans@scm.com
Gu Liang, GravityXR Electronics and Technology Co., Ltd., Ningbo, China, Email: lgu@gravityxr.cn
Guo Jian, BOE Technology Group Co., Ltd., Beijing, China, Email: guojian@boe.com.cn
Guo Jiandong, BOE Technology Group Co., Ltd., Beijing, China, Email: guojiandong@boe.com.cn
Guo Kaiyan, Peking University, Shenzhen, China, Email: 2301212936@stu.pku.edu.cn
Han Chang-Yeong, Samsung Display Co., Ltd., Ulsan, South Korea, Email: hcy0515@unist.ac.kr
Hao Junjie, Shenzhen Technology University, Shenzhen, China, Email: haojunjie@sztu.edu.cn
Hara Kengo, Sharp Corp., Mie, Japan, Email: hara_kengo@sharp.co.jp
Hayashi Michihiro, International College of Technology, Kanazawa, Japan, Email: mhayashi@neptune.kanazawa-it.ac.jp
He Nailong, Southeast University, Nanjing, China, Email: hnl@seu.edu.cn
Henzen Alex, HYPHY USA, Inc., Zoetermeer, Netherlands, Email: alex.h@hyphyusa.com
Heo Pilseung, Samsung Electronics Co., Ltd., Yongin, South Korea, Email: pilseung.heo@samsung.com
Heo Sanghyun, Samsung Display Co., Ltd., Yongin, South Korea, Email: sh0430a.heo@samsung.com
Hertel Dirk, E Ink Corp., Billerica MA, US, Email: dhertel@eink.com
Higuchi Masayoshi, National Institute for Materials Science, Tsukuba, Japan, Email: HIGUCHI.Masayoshi@nims.go.jp
Hirosawa Jin, Research & Development Division, Japan Display Inc., Mobara City, Japan, Email: jin.hirosawa.ge@j-display.com
Hohmann Kai, Continental Automotive Technologies GmbH, Babenhausen, Germany, Email: kai.hohmann@continental.com
Holm Jack, Tarkus Imaging, Carmel CA, US, Email: jack@tarkusimaging.com
Hong Yan Ping, Wuhan BOE Optoelectronics Technology Co., Ltd., Wuhan, China, Email: hongyanping@boe.com.cn
Hong Yongtaek, Seoul National University, Seoul, South Korea, Email: yongtaek@snu.ac.kr
Honjo Masatomo, Sharp Corp., Mie, Japan, Email: honjo.masatomo@sharp.co.jp
Hou Feng, BOE Technology Group Co., Ltd, Beijing, China, Email: houfeng@boe.com.cn
Hou Wenjun, TCL Corporate Research, Shenzhen, China, Email: wenjun.hou@tcl.com
Hsieh Pao-Ju, MCL/ITRI, Hsinchu, Taiwan ROC, Email: pjhsieh@itri.org.tw
Hsu Tsung-Chou, Industrial Technology Research Institute, Hsinchu, Taiwan Roc, Email: TJSHIU@ITRI.ORG.TW
Hu Darwin, Phasereality Lab., Sysview Technology Inc., San Jose CA, US, Email: darwin.hu@phasereality.com
Hu Jiangbo, Peking University, Shenzhen, China, Email: 2301212959@stu.pku.edu.cn
Hu Qinwei, Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd., Wuhan, China, Email: huqinwei1@tcl.com
Hu Yu-Ting, AUO Corporation, Hsinchu, Taiwan Roc, Email: yutingythu@auo.com
Hua Hong, The University of Arizona, Tucson AZ, US, Email: hhua@optics.arizona.edu
Hua Huang, BOE Technology Group Co. Ltd., Beijing, China, Email: huanghuahq@boe.com.cn
Hua Huomei, Tianma Display Technology Co., Ltd., Xiamen, China, Email: huomei_hua2@tianma.cn
Huang Huan-Chu, TCL China Star Optoelectronics Technology Co., Ltd., Langfang, China, Email: shinylucker@hotmail.com
Huang Jingxuan, Zhejiang University, Hangzhou, China, Email: 3210104375@zju.edu.cn
Huang Jinyan, Visionox Technology, Inc., Gu'an, China, Email: huangjy@visionox.com
Huang Shan, Hong Kong University of Science and Technology, Hong Kong, Hong Kong, Email: shuangcv@connect.ust.hk
Huang Wenliang, TCL China Star Optoelectronic Technology Co, Ltd., Shenzhen, China, Email: 1024923224@qq.com
Huang Wennuo, TCL China Star Optoelectronics Technology Co., Ltd., Shenzhen, China, Email: 93041807@qq.com
Huang Yao-Wei, National Yang Ming Chiao Tung University, Hsinchu, Taiwan ROC, Email: ywh@nycu.edu.tw
Huang Yu-Chien, AUO Corp., Hsinchu, Taiwan ROC, Email: Amber.YC.Huang@auo.com
Huang Yushyang, Himax Technologies Inc., Hsinchu, Taiwan Roc, Email: arthur_huang@himax.com.tw
Huang Zicong, Columbia University, New York NY, US, Email: zh2388@columbia.edu
Huh Myung soo, Samsung Display Co., Ltd., Yongin, South Korea, Email: huh1003@samsung.com
Huo Peirong, Ordos Yuansheng Optoelectronics Co., Ltd., Beijing, China, Email: huopeirong@boe.com.cn
Hwang Byung Seol, Hoseo University, Asan, South Korea, Email: hbs0987@naver.com
Hwang Chi-Sun, ETRI, Daejeon, South Korea, Email: hwang-cs@etri.re.kr
Hwang Yiyeon, LG Display Co., Ltd., Seoul, South Korea, Email: yiyeon@lgdisplay.com
Iimura Keita, Dai Nippon Printing co., Ltd., Fujimino, Japan, Email: Iimura-K2@mail.dnp.co.jp
Iizuka Takuro, Yamagata university, Yamagata, Japan, Email: t212291@st.yamagata-u.ac.jp
Ilasin Mark, Nara Institute of Science and Technology, Nara, Japan, Email: ilasin.mark_denusta.hy2@naist.ac.jp
In Chihyun, Kyung Hee University, Seoul, South Korea, Email: inchi503@khu.ac.kr
Inoue Masaru, TOYOTech LLC, Fremont CA, US, Email: masaru.inoue@toyotechus.com
Ishikawa Tomohiro, Corning, Inc., Corning NY, US, Email: ishikawat2@corning.com
Ito Minato, Semiconductor Energy Laboratory Co., Ltd., Kanagawa, Japan, Email: mi1271@sel.co.jp
Izawa Seiichiro, Institute of Science Tokyo, Yokohama, Japan, Email: izawa.s.ac@m.titech.ac.jp
Jang Jaemin, Sungkyunkwan University, Suwon, South Korea, Email: vnf321@naver.com
Jang Jin, Kyung Hee University, Seoul, South Korea, Email: jjang@khu.ac.kr
Jang Sejin, LG Display Co., Ltd., Seoul, South Korea, Email: sjjangc@lgdisplay.com
Jang Won Hyuk, Samsung Display Co., Ltd., Asan, South Korea, Email: wonhyuk.jang@samsung.com
Jeon Sanghun, Korea Advanced Institute of Science and Technology, Daejeon, South Korea, Email: jeonsh@kaist.ac.kr
Jeon Sohui, Panasonic Industry Co., Ltd., Osaka, Japan, Email: jeon.sohui@jp.panasonic.com
Jeong Choongmin, Samsung Display Co., Ltd., Yongin, South Korea, Email: cm.jeong0210@samsung.com
Jeong Hyeon-Su, Kyungpook National University, Daegu, South Korea, Email: abz6721@knu.ac.kr
Jeong Jae Kyeong, Hanyang University, Seoul, South Korea, Email: jkjeong1@hanyang.ac.kr
Jeong Jaebum, Gyeongsang National University, Jinju, South Korea, Email: iriver0208@gnu.ac.kr
Jeong Jeeho, Sungkyunkwan University, Suwon, South Korea, Email: wjdwlghsms@g.skku.edu
Jeun Jinhong, Samsung Display Co., Ltd., Yongin, South Korea, Email: jinhong.jeun@samsung.com
Jia Yiming, Yungu (Gu'an) Technology Co., Ltd., Beijing, China, Email: guym@visionox.com
Jing Qi, BOE Technology Group Co., Ltd., Beijing, China, Email: jingqi@boe.com.cn
Jo Unhyeok, Sungkyunkwan University, Suwon, South Korea, Email: whdnsgur1997@naver.com
Jung Ha-Rim, Sungkyunkwan University, Suwon, South Korea, Email: jhl9911@g.skku.edu
Jung Jae-Won, Sungkyunkwan University, Suwon, South Korea, Email: paulus1206@gmail.com
Jung Sukbin, Samsung Display Co., Ltd., Yongin, South Korea, Email: sukbin.jung@samsung.com