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2025 DW Speaker Contact Information

Ma Jie, BOE Display Technology Co., Ltd., Beijing, China, Email: majie-ot@boe.com.cn

Ma Siyan, BOE Technology Group Co., Ltd., Beijing, China, Email: masiyan@boe.com.cn

Ma Yongziyan, University of Central Florida, Orlando FL, US, Email: yongziyan.ma@ucf.edu

Majumder Aditi, University of California, Irvine CA, US, Email: aditi@summittechlab.com

Malinowski Pawel, imec, Leuven, Belgium, Email: pawel.malinowski@imec.be

Mallem Kumar, Hong Kong University of Science and Technology, Hong Kong, Hong Kong, Email: kmallem@connect.ust.hk

Managaki Nobuto, Japan Display, Inc., Mobara, Japan, Email: nobuto.managaki.rt@j-display.com

Mao Ke, Guangzhou China Star Optoelectronics Semiconductor Display Technology Co., Ltd., Guangzhou, China, Email: maoke1@tcl.com

Martinez Christophe, CEA - Leti, Grenoble, France, Email: christophe.martinez@cea.fr

Martinovic Ivan, Polar Light Technologies AB, Linköping, Sweden, Email: ivan.martinovic@polar-light-technologies.com

Mathew Chris, Hong Kong University of Science and Technology, Hong Kong, Hong Kong, Email: cmathew@connect.ust.hk

Matsuhisa Naoji, The University of Tokyo, Tokyo, Japan, Email: naoji@iis.u-tokyo.ac.jp

matsumoto Eiichi, Canon Tokki Corporation, Niigata, Japan, Email: matsumoto.eiichi@mail.canon

Matsushima Toshiharu, Japan Display Inc., Mobara City, Japan, Email: toshiharu.matsushima.en@j-display.com

Mei Jie, TCL China Star Optoelectronics Technology Co., Ltd., Shenzhen, China, Email: meijie1@tcl.com

Meng Hong, Peking University, Shenzhen, China, Email: 904544863@qq.com

Mi Zetian, University of Michigan, Ann Arbor MI, , Email: ztmi@umich.edu

Min Cheong-Wan, Samsung Display Co., Ltd., Yongin, South Korea, Email: cw.min@samsung.com

Min Sung-Wook, Kyung Hee University, Seoul, South Korea, Email: mins@khu.ac.kr

Minami Daisuke, Sharp Corp., Nara, Japan, Email: minami.daisuke@sharp.co.jp

Minixhofer Rainer, ams-OSRAM AG, Premstaetten, Austria, Email: rainer.minixhofer@ams-osram.com

Mischok Andreas, University of Cologne, Köln, Germany, Email: andreas.mischok@uni-koeln.de

Mochizuki Akihiro, I-CORE Technology LLC, Louisville CO, US, Email: akihiros@i-coretechnology.com

Moggridge Tim, Westboro Photonics, Ottawa ON, Canada, Email: timm@wphotonics.com

Moon Jangho, Sungkyunkwan University, Suwon, South Korea, Email: sldkffkxhxpq@gmail.com

Moon Junyoung, Sungkyunkwan University, Suwon, South Korea, Email: mjy1100@gmail.com

Murata Koji, Samsung R&D Institute Japan Co., Ltd., Yokohama, Japan, Email: murata.koji@samsung.com

Nakada Masataka, Semiconductor Energy Laboratory Co., Ltd., Tochigi, Japan, Email: mnakada@t.sel.co.jp

Nakagawa Yuki, FUJIFILM Corporation, Minamiashigara, Japan, Email: yuki.nakagawa@fujifilm.com

Nakamura Nasato, Idemitsu Kosan Co., Ltd., Chiba, Japan, Email: masato.nakamura.9890@idemitsu.com

Nakano Taketoshi, NICHIA Corporation, Tokushima, Japan, Email: taketoshi.nakano@nichia.co.jp

Nam Hyoungsik, Kyung Hee University, Seoul, South Korea, Email: hyoungsiknam@khu.ac.kr

Nam Sooji, Electronics and Telecommunications Research Institute, Daejeon, South Korea, Email: sjnam15@etri.re.kr

Neumann Franz, Nanomatch GmbH, Karlsruhe, Germany, Email: franz.symalla@nanomatch.com

Neyts Kristiaan, The Hong Kong University of Science and Technology, Hong Kong, Hong Kong, Email: eeneyts@ust.hk

Nilsen Kevin, University of Central Florida, Orlando FL, US, Email: kevin.nilsen@ucf.edu

Ning Cong, BOE Technology Group Co., Ltd., Beijing, China, Email: congning@boe.com.cn

Niu Jingran, Beijing BOE CHUANGYUAN Technology Co., Ltd., Beijing, China, Email: niujingran@boe.com.cn

Noguchi Yutaka, Meiji University, Kawasaki, Japan, Email: noguchi@meiji.ac.jp

Noh Yong-Young, Pohang University of Science and Technology, Pohang, South Korea, Email: yynoh@postech.ac.kr

O'Brien David, ams OSRAM, Hillsboro OR, US, Email: david.obrien@ams-osram.com

Oh Chung-Seog, Kumoh National Institute of Technology, Gumi, South Korea, Email: ocs@kumoh.ac.kr

Oh Kummi, LG Display Co., Ltd., Paju, South Korea, Email: saac2@lgdisplay.com

Oh Youngjin, Samsung Display, Asan, South Korea, Email: young.jin.oh@samsung.com

Ohtsuka Sakuichi, International College of Technology, Ishikawa, Japan, Email: sakuichi.ohtsuka@nifty.com

Oono Taku, Japan Broadcasting Corp., Tokyo, Japan, Email: oono.t-jo@nhk.or.jp

Pan Zhihong, Samsung Display America Lab, San Jose CA, US, Email: zhihong.pan@samsung.com

pang Huiqing, Summer Sprout Technology Co., Ltd., Beijing, China, Email: pang@summersprout.com

Park Bum June, Hongik University, Seoul, South Korea, Email: angdoo1329@naver.com

Park Chae-Hwan, Seoul National University, Seoul, South Korea, Email: ordlike@snu.ac.kr

Park Chanjin, Seoul National University, Seoul, South Korea, Email: chanjinpark97@snu.ac.kr

Park Han Wool, LG Display Co., Ltd., Paju, South Korea, Email: hanwool.park@lgdisplay.com

Park Hyun Sung, Samsung Display Co., Ltd., Yongin, South Korea, Email: hs23.park@samsung.com

Park Jae Sung, Samsung Electronics, Suwon, South Korea, Email: gogojs8902@gmail.com

Park Jae-Hyeung, Seoul National University, Seoul, South Korea, Email: jaehyeung@snu.ac.kr

Park Jin-Seong, Hanyang University, Seoul, , Email: jsparklime@hanyang.ac.kr

Park Ji-Sub, LG Display Co., Ltd., Gumi, South Korea, Email: jspark19@lgdisplay.com

Park Junho, Samsung Electronics, Hwaseong, South Korea, Email: jay_ho.park@samsung.com

Park Junsu, Samsung Display Co., Ltd., Yongin, South Korea, Email: js8116.park@samsung.com

Park kyongtae, AI TF of Mobile Business Samsung Display, SuwonCity, South Korea, Email: ktman.park@samsung.com

Park kyongtae, Samsung Display, SuwonCity, South Korea, Email: ktman.park@samsung.com

Park Minsu, Sungkyunkwan University, Suwon, South Korea, Email: kkumtle0812@naver.com

Park Sanghyun, Soongsil University, Seoul, South Korea, Email: psh7059@soongsil.ac.kr

Park Seki, Samsung Display, Asan, South Korea, Email: seki.park@samsung.com

Park Seongan, Samsung Display Co., Ltd., Yongin, South Korea, Email: seongan.park@samsung.com

Park Soonnyung, Sungkyunkwan University, Suwon, South Korea, Email: rkddlwife@naver.com

Park Taeyoung, Samsung Display Co., Ltd., Hwaseong, South Korea, Email: ty07.park@samsung.com

Park Ye-In, Sogang University, Seoul, South Korea, Email: yeng3070@gmail.com

Park Youngmin, Samsung Display Co., Ltd., Yongin, South Korea, Email: youngmin81.park@samsung.com

Pei Chunyang, Zhejiang University, Hangzhou, China, Email: chunyangpei@zju.edu.cn

Pelessier Michael, CEA-LETI, Grenoble, France, Email: michael.pelissier@cea.fr

Peng Yifan, University of Hong Kong, Hong Kong, Hong Kong, Email: evanpeng@hku.hk

Piehn Thomas, Emberion Limited, Cambridge, United Kingdom, Email: tom.piehn@emberion.com

Qian Yizhou, University of Central Florida, Orlando FL, US, Email: Yizhou.Qian@ucf.edu

Qiao Yatong, BOE Technology Group Co., Ltd., Beijing, China, Email: qiaoyatong@boe.com.cn

Qin Zong, Sun Yat-Sen University, Guangzhou, China, Email: qinzong@mail.sysu.edu.cn

Rao Ruiheng, Tianma Microelectronics Co., Ltd., Wuhan, China, Email: ruiheng_rao@tianma.cn

Reinhardt Sascha, Instrument Systems GmbH, Munich, Germany, Email: reinhardt@instrumentsystems.com

Ren Beitao, The Hong Kong University of Science and Technology, Hong Kong, Hong Kong, Email: bren@connect.ust.hk

Ren Chunhui, Kunshan Govisionox Optoelectronics Co., Ltd., Jiangsu, China, Email: rench@visionox.com

Ren Wenming, Nanjing BOE Display Technology Corp., Nanjing, China, Email: renwenming@boe.com.cn

Ritter Julian, Institute of Microelectronics, Saarland University, Saarbruecken, Germany, Email: julian.ritter@lme.uni-saarland.de

Roh Jongduk, Samsung Display Co., Ltd., Yongin, South Korea, Email: rjd2208@gmail.com

Rose Jon, Analog Devices, Colorado Springs CO, US, Email: Jon.Rose@analog.com

Rotscholl Ingo, TechnoTeam Bildverarbeitung GmbH, Ilmenau, Germany, Email: Ingo.Rotscholl@technoteam.de

Ryu Seungchul, Irystec Faurecia, Inc., Montreal PQ, Canada, Email: aiden.ryu@forvia.com

Saito Nobuo, Sharp Corporation, Tenri, Japan, Email: saito.nobuo@sharp.co.jp

Sakai Toru, Touch Biometrix Ltd., Eindhoven, Netherlands, Email: t.sakai@touchbiometrix.com

Sasaki Shizuki, Keio University, Kawasaki, Japan, Email: shizuki.sasaki@kpri.keio.ac.jp

Schmidt Hennrik, Plansee USA LLC, Franklin MA, US, Email: hennrik.schmidt@plansee.com

Schubert Alexander, Merck KGaA, Darmstadt, Germany, Email: Alexander.Schubert@merckgroup.com

Semenenko Oleksandr, Hong Kong University of Science and Technology, Hong Kong, Hong Kong, Email: eesemenenko@ust.hk

Semmen John, University of Central Florida, Orlando FL, US, Email: john.semmen@ucf.edu

Seo Jin-Hyeok, Kyungpook National University, Daegu, South Korea, Email: lduck1999@knu.ac.kr

Sharma Atul, Synaptics Japan G.K., Tokyo, Japan, Email: Atul.Sharma@synaptics.com

Shen Ying, Kunshan Govisionox Optoelectronics Co., Ltd., Kunshan, China, Email: shenying@visionox.com

Shen Ying, Kunshan Govisionox Optoelectronics Co., Ltd., Kunshan, China, Email: shenying@visionox.com

Sherliker Ben, Trulife Optics, london, United Kingdom, Email: ben@trulifeoptics.com

Shi Bo, BOE Optoelectronics Group Co., Ltd., Chengdu, China, Email: shibo@boe.com.cn

Shi Ling, BOE Optoelectronics Group Co., Ltd., Chengdu, China, Email: shiling@boe.com.cn

Shi Zhujun, Meta, Redmond WA, US, Email: zhujunshi@meta.com

Shim Jeahyun, Solus Advansed Materials, Seongnam, South Korea, Email: jeahyun.shim@solusam.com

Shima Kengo, Tokai Rika co., Ltd, Aichi, Japan, Email: kengo.shima@exc.tokai-rika.co.jp

Shima Yukinori, Semiconductor Energy Laboratory Co., Ltd., Tochigi, Japan, Email: shima@t.sel.co.jp

Shimayama Tsutomu, Sony Semiconductor Solutions Corporation, Atsugi, Japan, Email: Tsutomu.Shimayama@sony.com

Shin Dong Jin, Sungkyunkwan University, Suwon, South Korea, Email: sdj0415@naver.com

Shin Heekyun, Samsung Display Co., Ltd., Yongin, South Korea, Email: hk75.shin@samsung.com

Shin Hong-Jae, LG Display Co., Ltd., Paju, South Korea, Email: hongjae.shin@lgdisplay.com

Shin Yasumasa, Dexerials America Corporation, Santa Clara CA, , Email: Yasumasa.Shin@dexerials.com

Shiqi Ji, Guangzhou Govisionox Technology Co., Ltd., Guangzhou, China, Email: jisq@visionox.com

Siyi Hu, BOE Optoelectronics Group Co., Ltd., Chengdu, China, Email: liufengjian@boe.com.cn

Slischka Burkhard, ALLOS Semiconductors, Dresden, Germany, Email: burkhard.slischka@allos-semiconductors.com

Song Hee Kwang, Samsung Display Co., Ltd., Yongin, South Korea, Email: hk79.song@samsung.com

Song Jang-Kun, Sungkyunkwan University, Suwon, South Korea, Email: jk.song@skku.edu

Song Jie, Saphlux, INC., San Diego CA, US, Email: jie.song@saphlux.com

Song Li, Everfine Corp., Hangzhou, China, Email: tech@everfine.cn

Song Wenfeng, Yungu (Gu'an) Technology Co., Ltd. (Gu'an Visionox), Langfang, China, Email: songwf@visionox.com

Song Yanjun, China Star Optoelectronics Technology Co., Ltd., Guangzhou, China, Email: songyanjun@tcl.com

Song You Na, Hongik University, Seoul, South Korea, Email: dbsk2781@naver.com

Song Zheyuan, BOE Technology Group Co., Ltd, Beijing, China, Email: songzheyuan@boe.com.cn

Sporea Radu, University of Surrey, Guildford, UK, Email: r.a.sporea@surrey.ac.uk

Stanzani Edoardo, FLUXiM AG, Winterthur, Switzerland, Email: edoardo.stanzani@fluxim.com

Steudel Soeren, MICLEDI microdisplay BV, Leuven, Belgium, Email: soeren.steudel@micledi.com

Stockman Andrew, UCL Institute of Ophthalmology, London, UK, Email: a.stockman@ucl.ac.uk

Stolz Julia, CREDOXYS GmbH, Dresden, Germany, Email: julia.stolz@credoxys.com

Su Jyun-Wei, National Yang Ming Chiao Tung University, Hsinchu, Taiwan Roc, Email: jyunwei.su.ee12@nycu.edu.tw

Suh Min Chul, Kyung Hee University, Seoul, South Korea, Email: mcsuh@khu.ac.kr

Sumi Toshikazu, FUJIFILM Corporation, Minamiashigara, Japan, Email: toshikazu.sumi@fujifilm.com

Sun Hejing, TCL China Star Optoelectronics Technology Co., Ltd., Shenzhen, China, Email: sunhejing@tcl.com

Sun Yuanhao, BOE Technology Group Co., Ltd., Beijing, China, Email: sunyuanhao@boe.com.cn

Sundaram Venky, 3D System Scaling LLC, Johns Creek GA, US, Email: venky@3dsystemscaling.com

Sung Seung Hyun, LG Display Co., Ltd., Seoul, South Korea, Email: shsung41@lgdisplay.com

Surman Philip, Southern University of Science and Technology, Shenzhen, China, Email: philip2021@mail.sustech.edu.cn

Taieb Yoav, Visionary.ai, Jerusalem, Israel, Email: yoav@visionary.ai

Tajvidi Safa Hosna, University of Central Florida, Orlando FL, US, Email: ho690641@ucf.edu

Takiyama Kazuaki, Utsunomiya University, Utsunomiya, Japan, Email: k_takiyama@yamamotolab.science

Tamatsukuri Yuki, Semiconductor Energy Laboratory Co., Ltd., Kanagawa, Japan, Email: yt1198@sel.co.jp

Tanaka Kohhei, Sharp Corporation, Nara, Japan, Email: tanaka.kohhei@sharp.co.jp

Tang Xiaojun, BOE Technology Group Co., Beijing, China, Email: tangxiaojun@boe.com.cn

Tang Ying, Shenzhen Technology University, Shenzhen, China, Email: tangying@sztu.edu.n

Tang Yu-Ying, Novatek Microelectronics Corp., Hsinchu, Taiwan ROC, Email: tarks_tang@novatek.com.tw

Tasaki Satomi, Idemitsu Kosan Co., Ltd., Chiba, Japan, Email: satomi.tasaki.7800@idemitsu.com

Terashita Shinichi, Sharp Corp., Nara, Japan, Email: terashita.shinichi@sharp.co.jp

Thom Martin, ZEISS Microoptics, Jena, Germany, Email: martin.thom@zeiss.com

Tian Jian, BOE RuiSheng Technology Co., Ltd., Hefei, China, Email: tianjian@boe.com.cn

Tian Kehan, Goertek Optical Technology Co. Ltd., Weifang, Shandong, China, Email: kehan.tian@goeroptics.com

Tian Wenya, BOE Technology Group Co., Ltd., Beijing, China, Email: tianwenya@boe.com.cn

Tohidypour Hamid Reza, University of British Columbia, Vancouver BC, Canada, Email: htohidyp@ece.ubc.ca

Tsai YuTang, AUO Corp., Hsinchu, Taiwan ROC, Email: yutomtsai@auo.com

Tseng Heng-Yi, AUO Corp., Hsinchu, Taiwan ROC, Email: Oliver.Tseng@auo.com

Tsuchiya Haruki, Sony Semiconductor Solutions Corp., Atsugi, Japan, Email: Haruki.Tsuchiya@sony.com

Tsuji Hiroshi, NHK Science & Technology Research Laboratories, Tokyo, Japan, Email: tsuji.h-hi@nhk.or.jp

Tsujino Kazuya, Sharp Corporation, Tenri, Nara, Japan, Email: tsujino.kazuya@sharp.co.jp

Tsung Wan-Nung, Novatek Microelectronics Corp., Hsinchu, Taiwan ROC, Email: winny_tsung@novatek.com.tw

Tu Chia-Hsun, Industrial Technology Research Institute, Hsinchu, Taiwan Roc, Email: scott.tu@itri.org.tw

Tuffin Rachel, Merck KGaA, Darmstadt, Germany, Email: RACHEL.TUFFIN@MERCKGROUP.COM

Usukura Naru, Sharp Corp., Tenri, Japan, Email: usukura.naru@sharp.co.jp

Virey Eric, Yole Group, Portland OR, US, Email: eric.virey@yolegroup.com

Voros Viktor, Barco NV, Kortrijk, Belgium, Email: viktor.voros@barco.com

Walker Bright, Kyung Hee University, Seoul, South Korea, Email: walker@khu.ac.kr

Wang Bingqian, BOE Technology Group Co., Ltd., Beijing, China, Email: wangbingqian@boe.com.cn

Wang Fang, Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd., Wuhan, China, Email: wangfang24@tcl.com

Wang Jia-Hong, AUO Corporation, Hsinchu, Taiwan Roc, Email: Martin.MT.Weng@auo.com

Wang Jihui, Goertek Co., Ltd., Xi'an, China, Email: jihui.wangj@goertek.com

Wang Jing, BOE Technology Group Co., Ltd., Beijing, China, Email: wangjing3@boe.com.cn

Wang Lutong, BOE Technology Group Co., Ltd., Beijing, China, Email: wanglutong@boe.com.cn

Wang Qiong-Hua, Beihang University, Beijing, China, Email: qionghua@buaa.edu.cn

Wang Shasha, BOE Optoelectronics Group Co., Ltd., Chengdu, China, Email: wangshasha-b7@boe.com.cn

Wang Shibiao, Beijing BOE CHUANGYUAN Technology Co., Ltd., Beijing, China, Email: wangshibiao@boe.com.cn

Wang Tao, BOE Technology Group Co., Ltd., Beijing, China, Email: wangtao327@boe.com.cn

Wang Wan-Tsang, AUO Corporation, Hsinchu City, Taiwan Roc, Email: Winston.Wang@auo.com

Wang Wenqi, Southeast University, Jiangsu, China, Email: wangwenqi@seu.edu.cn

Wang Yanqiang, BOE Optoelectronics Group Co., Ltd., Chengdu, China, Email: wangyanqiang@boe.com.cn

Wang Ying, Beijing BOE SINCE Technology Co. Ltd., Beijing, China, Email: wangying_boeot@boe.com.cn

Wang Yu-Wen, National Taiwan University, Taipei, Taiwan ROC, Email: yuwen.wang1124@gmail.com

Wang Zhibin, OTI Lumionics, Inc., Toronto ON, Canada, Email: zhibin.wang@otilumionics.com

Wang Zhiqiang, BOE Technology Group Co., Ltd., Beijing, China, Email: hezhifei@boe.com.cn

Wang Zuojia, TCL China Star Optoelectronics Technology Co., Ltd., Wuhan, China, Email: wzj771859656@163.com

Wartenberg Philipp, Fraunhofer Institute for Photonic Microsystems IPMS, Dresden, Germany, Email: philipp.wartenberg@ipms.fraunhofer.de

Weber Markus, Continental Automotive Technologies GmbH, Babenhausen, Germany, Email: markus.weber@continental.com

Wei Qiumei, BOE Technology Group Co., Ltd., Beijing, China, Email: weiqiumei@boe.com.cn

Wei Qiuxu, Beijing BOE Sensor Technology Company, Ltd., Beijing, China, Email: weiqiuxu@boe.com.cn

Wei Qiuxu, Beijing BOE Sensor Technology Company, Ltd., Beijing, China, Email: weiqiuxu@boe.com.cn

Wei Zhengfei, Oxford Instruments Plasma Technology, Bristol, United Kingdom, Email: zhengfei.wei@oxinst.com

Wen Chao-Hua, National Taiwan University of Science and Technology, Taipei, Taiwan ROC, Email: chwen@mail.ntust.edu.tw

Wen Chaoping, TCL China Star Optoelectronics Technology Co., Ltd., Shenzhen, China, Email: wenchaoping1@tcl.com

Wen Xin, BOE Technology Group Co., Ltd., Beijing, China, Email: wenxin@boe.com.cn

Wen Yating, Shenzhen China Star Optoelectronics Technology Co., Ltd., Guangdong, China, Email: 841172447@qq.com

Weng Yishi, Southeast University, Nanjing, China, Email: yishi@seu.edu.cn

Widmaier Markus, University of Stuttgart, Stuttgart, Germany, Email: markus.widmaier@igm.uni-stuttgart.de

Wilson Cameron, School of Engineering, The University of Edinburgh, Edinburgh, Scotland Uk, Email: C.R.M.Wilson@sms.ed.ac.uk

Woo Hye-Won, Sungkyunkwan University, Suwon, South Korea, Email: hwwskku17@g.skku.edu

Woodgate Graham, Rain Technology, Oxford, UK, Email: graham.woodgate@raintechnology.com

Wooley Kelsey, Eulitha US, Remond WA, US, Email: kelsey.wooley@eulitha.com

Wu Chih-Ling, PlayNitride Inc., Miaoli, Taiwan Roc, Email: lynchwu@playnitride.com

Wu Fung Hsu, BenQ Materials Corp., Taoyuan, Taiwan ROC, Email: geoffrey.wu@benqmaterials.com

Wu Lina, TCL Huaxing Optoelectronics Technology Co., Ltd., Shenzhen, China, Email: 2804340692@qq.com

Wu Qi-Lun, AUO Corp., Hsinchu, Taiwan ROC, Email: Kelen.wu@auo.com

Wu Tianyu, North Carolina State University, Raleigh NC, US, Email: tianyuwu412@gmail.com

Wu Yaodong, Tianma Microelectronics Co., Ltd., Shanghai, China, Email: yaodong_wu@tianma.cn

Wu Yung-Hsun, Innolux CORP., Miaoli County, , Email: yhwu0922@gmail.com

Xi Fenglin, Kent State University, Kent OH, US, Email: fxi1@kent.edu

Xia Xinxing, Shanghai University, Shanghai, China, Email: lygxia@gmail.com

Xiang Jie, Meta, Sunnyvale CA, US, Email: jiexiang@meta.com

Xiao JunYing, BOE Technology Group Co., Ltd., Beijing, China, Email: xiaojunying@boe.com.cn

Xiao Qian, Mianyang BOE Optoelectronics Technology Co., Ltd., Mianyang, China, Email: xiaoqian@boe.com.cn

Xiao Xiangwu, BOE Technology Group Co., Ltd., Beijing, China, Email: xiaoxiangwu@boe.com.cn

Xiao Yiming, Hefei Visionox Technology Co., Ltd., Hefei, China, Email: xiaoym@visionox.com

Xiao Yixin, TCL China Star Optoelectronics Technology Co., Ltd., Shenzhen, China, Email: xiaoyixin1@tcl.com

Xie Huichen, Wuhan China Star Optoelectronics Semiconductor Display Technology Coporation, Wuhan, China, Email: xiehuichen1@tcl.com

Xie Yuanxiang, Guangzhou China Star Optoelectronics Semiconductor Display Technology Co., Ltd., Guangzhou, China, Email: xieyuanxiang1@tcl.com

Xin Li, Yongjiang Laboratory, Ningbo, China, Email: xin-li@ylab.ac.cn

Xing Dong Ming, Beijing BOE Sensor Technology Co., Ltd., Beijing, China, Email: xingdongming@boe.com.cn

Xing Hao, TCL China Star Optoelectronics Technology, Shenzhen, China, Email: xinghao114@163.com

Xiong Na, Tianma Microelectronics Co., Ltd., Shanghai, China, Email: nana_xiong@tianma.cn

Xu Chengyi, BOE Technology Group Co., Ltd., Hefei, China, Email: xuchengyi@boe.com.cn

Xu Chuanzhi, Kunshan Govisionox Optoelectronics Co., Ltd., Kunshan, China, Email: xucz@visionox.com

Xu Guobin, Nanjing Bready Advanced Materials Technology Co., Ltd., Nanjing, China, Email: njyf01@bready.cn

Xu Wei, TCL AI Lab, Hong Kong, Hong Kong, Email: williamxu@tcl.com

Xu Xiaowei, Visionox Technology, Inc., Gu’an, China, Email: xuxw@visionox.com

Yamada Kazuyuki, Japan Display Inc., Tokyo, Japan, Email: kazuyuki.yamada.vn@j-display.com

Yan Yiran, TCL Research, Guangzhou, China, Email: yiran.yan@tcl.com

Yan Zhimin, Visionox Technology, Inc., Gu’an, China, Email: yanzm@visionox.com

Yang Bo-Ru, Sun Yat-Sen University, Guangzhou, China, Email: yangboru@mail.sysu.edu.cn

Yang Chieh-Han, Industrial Technology Research Institute, Hsinchu, Taiwan ROC, Email: itriB20349@itri.org.tw

Yang Chiu-lien, Innolux CORP., Miaoli County, Taiwan Roc, Email: chiulien59@gmail.com

Yang Guoping, Mianyang HKC Optoelectronics Technology Co., Ltd., Mianyang, China, Email: 18681647974@163.com

Yang Hang, Southern University of Science and Technology, Shenzhen, China, Email: 12131047@mail.sustech.edu.cn

Yang Huanli, TCL China Star Optoelectronics Technology Co., Ltd., Wuhan, China, Email: yanghuanli@tcl.com

Yang Junghyun, Samsung Display Co., Ltd., Yongin, South Korea, Email: jh1231.yang@samsung.com

Yang Mei, South China University of Technology, Guangzhou, China, Email: yangmei19@163.com

Yang Qing, Yungu (Gu'an) Technology Co., Ltd., Hebei, China, Email: yangqing01@visionox.com

Yang Shan Wei, BOE MLED Technology Co., Ltd., Beijing, China, Email: yangshanwei@boe.com.cn

Yang Xinru, TCL CSOT, Shenzhen, China, Email: yangxinru1@tcl.com

Yang Ya-Ru, National Yang Ming Chiao Tung University, Hsinchu, Taiwan ROC, Email: csyangkelly@gmail.com

Yang Yefei, Hefei Visionox Technology Co., Ltd., Hefei, China, Email: yangyf04@visionox.com

Yang Yi, Donghua University, Shanghai, China, Email: yiyang@dhu.edu.cn

Yang Yunqiang, Hefei Visionox Technology Co., Ltd., Hefei, China, Email: yangyq04@visionox.com

Ye Jia-Hong, AUO Corp., Hsinchu, Taiwan Roc, Email: JiaHong.Ye@auo.com

Yi Cen, TCL China Star Optoelectronics Technology Co., Ltd., Shenzhen, China, Email: yicen@tcl.com

Yin Shujuan, BOE, Beijing, China, Email: yinshujuan@boe.com.cn

Yin Xiong, Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd., Wuhan, China, Email: yinxiong4@tcl.com

Yin Yanzhen, Southern University of Science and Technology, Shenzhen, China, Email: 12231043@mail.sustech.edu.cn

Yoda Taiki, Kwansei Gakuin University, Sanda, Japan, Email: hak38507@kwansei.ac.jp

Yoo Jae-In, Sungkyunkwan University, Suwon, South Korea, Email: ytusnj1@g.skku.edu

Yoo Jang Jin, LG Display Co., Ltd., Seoul, South Korea, Email: 1yoo@lgdisplay.com

Yoo Jewon, Samsung Display, Yongin, South Korea, Email: jewon.yoo@samsung.com

Yoo Seunghyup, KAIST, Daejeon, South Korea, Email: syoo.ee@kaist.edu

Yoo Yong-Su, LG Electronics, Seoul, South Korea, Email: yongsu.yoo@lge.com

Yoon Jangyeol, Samsung Display, Yongin, South Korea, Email: jangyeol.yoon@samsung.com

Yoon Juyoung, Samsung Display Co., Ltd., Yongin, South Korea, Email: jy.yoon@samsung.com

Yoshida Hidehiro, Panasonic Production Engineering, Osaka, Japan, Email: yoshida.hidehiro@jp.panasonic.com

Yoshida Kou, University of St Andrews, St Andrews, United Kingdom, Email: ky25@st-andrews.ac.uk

Yu Chao-Ming, Industrial Technology Research Institute., Hsinchu, Taiwan ROC, Email: itriB20233@itri.org.tw

Yu Xiao-Ping, TCL China Star Optoelectronics Technology Co., Ltd., Shenzhen, China, Email: yuxiaoping@tcl.com

Yu Xingxing, BOE Technology Group Co., Ltd., Beijing, China, Email: yuxingxing@boe.com.cn

Yu Xinyi, Hong Kong University of Science and Technology, Hong Kong, Hong Kong, Email: xyubm@connect.ust.hk

Yu Yun, Tianma Microelectronics Co., Ltd., Wuhan, China, Email: yun_yu@tianma.cn

Yuan Xuyang, Wuhan China Star Optoelectronics Technology Co., Ltd, WuHan, China, Email: yuanxuyang1@tcl.com

Yuan Yuan, TCL China Star Optoelectronics Display Technology Co. Ltd., Shenzhen, China, Email: yuanyuan15@tcl.com

Yuan Ze, Yongjiang Laboratory, Ningbo, China, Email: ze-yuan@ylab.ac.cn

Yue Yang, BOE, BeiJing, China, Email: yueyang@boe.com.cn

Zeller Sonja, Fraunhofer IAP-CAN, Hamburg, Germany, Email: sonja.zeller@iap.fraunhofer.de

Zeng Chao, BOE Optoelectronics Group Co., Ltd., Chengdu, China, Email: cengchao@boe.com.cn

Zeng Ting, HeFei BOE RuiSheng Technology Co., Ltd., Hefei, China, Email: zengting@boe.com.cn

Zeng Yang, Tianma Microelectronics Co., Ltd., Shanghai, China, Email: yang_zeng@tianma.cn

Zeng Yu Sheng, Novatek Microelectronics Corp., Hsinchu, Taiwan ROC, Email: Eason_Tseng@novatek.com.tw

Zhang Dongdong, Tsinghua University, Department of Chemistry, Beijing, China, Email: ddzhang@mail.tsinghua.edu.cn

Zhang Guan, BOE Sensing Technology Co., Ltd., Beijing, China, Email: zhangguan-cgjs@boe.com.cn

Zhang Hao, BOE Technology Group Co., Ltd., Beijing, China, Email: zhanghao_ot@boe.com.cn

Zhang Hejing, Chongqing Advanced Photoelectric Display Technology Research Institute, Chongqing, China, Email: hejing.zhang@szhk.com.cn

Zhang Min, The Chinese University of Hong Kong, Shenzhen, Shenzhen, China, Email: mzhang@cuhk.edu.cn

Zhang Sikai, Beijing BOE SINCE Technology Co. Ltd., Beijing, China, Email: zhangsikai@boe.com.cn

Zhang Wengao, TCL China Star Optoelectronics Technology Co., Ltd., ShenZhen, China, Email: Zhang.W.G@outlook.com

Zhang Wenshuai, Tianma Microelectronics Co., Ltd., Wuhan, China, Email: wenshuai_zhang@tianma.cn

Zhang Xiaohe, Beijing BOE Display Technology Co., Ltd., Beijing, China, Email: zhangxiaohe@boe.com.cn

Zhang Ye, Columbia University, New York NY, US, Email: yz4174@columbia.edu

Zhang Yunpeng, BOE Optoelectronics Group Co., Ltd., Chengdu, China, Email: zhangyunpeng@boe.com.cn

Zhao Chumin, US FDA, Silver Spring MD, US, Email: chumin.zhao@fda.hhs.gov

Zhao Duokai, China Star Optoelectronic Technology Co, Ltd., Shenzhen, China, Email: matrixdk@126.com

Zhao Haonan, University of Michigan, Ann Arbor, Ann Arbor MI, US, Email: haonanzh@umich.edu

Zhao Hongwei, XiaMen Tianma Microelectronics Co., Ltd., XiaMen, China, Email: hongwei_zhao@tianma.cn

Zhao Juewen, Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd., Wuhan, China, Email: zhaojuewen1@tcl.com

Zhao Le, Beijing BOE Chuangyuan Technology Co., Ltd., Beijing, China, Email: zhaole@boe.com.cn

Zhao Lei, Yongjiang Laboratory, Ningbo, China, Email: lei-zhao@ylab.ac.cn

Zhao Yuanyang, BOE Corp., Beijing, China, Email: zhaoyuanyang-b3@boe.com.cn

Zheng Kening, BOE Optoelectronics Group Co., Ltd., Chengdu, China, Email: zhengkening@boe.com.cn

Zheng Yixin, Shenzhen Technology University, Shenzhen, China, Email: 202201201011@stumail.sztu.edu.cn

Zheng Yuan, Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd., Wuhan, China, Email: zhengyuan@tcl.com

Zhou Juping, TCL China Star Optoelectronic Technology Co, Ltd., Shenzhen, China, Email: zhoujuping1@tcl.com

Zhou Xiaochen, GravityXR Electronics and Technology Co.Ltd., Zhejiang, China, Email: xczhou@gravityxr.cn

Zhou Xiaokang, Visionox Technology, Inc., Gu’an, China, Email: zhouxk@visionox.com

Zhou Xiaoliang, TCL China Star Optoelectronics Technology Co., Ltd., Shenzhen, China, Email: zhouxiaoliang1@tcl.com

Zhu Hongpeng, TCL China Star Optoelectronics Technology Co., Ltd., Shenzhen, China, Email: zhuhongpeng1@tcl.com

Zhu Xiujian, Kunshan Govisionox Optoelectronics Co., Ltd., Kunshan, China, Email: zhuxj@visionox.com